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1 flip-chip bump
стовпчиковий вивід переверненого кристалаEnglish-Ukrainian dictionary of microelectronics > flip-chip bump
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2 bump
стовпчиковий вивід, контактний стовпчик - external bump
- flip-chip bump
- gang-bonding bump
- plated bump
- solder bump
- sputtered gold bump -
3 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
См. также в других словарях:
flip-chip bump — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
Flip-Chip-Höcker — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads … Wikipedia
poutre de flip-chip — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… … Wikipedia
gūburinis apverstojo lusto išvadas — statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
poutre de cristal inverse — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
столбиковый вывод перевёрнутого кристалла ИС — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f … Radioelektronikos terminų žodynas
Ultratech, Inc. — Ultratech, Inc. nasdaq|UTEK is a publicly traded international technology company based in San Jose, California which supplies equipment to global semiconductor fabs and foundries, and also makes industry leading tools for nanotechnology… … Wikipedia
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia